Patina Chemicalspatina®

The Patina portfolio

Chemistry for stronger, cleaner, safer panels.

Bio-based adhesives, extenders, resin boosters, formaldehyde scavengers, nano-particle fire retardants and botanical wood protection — each engineered for a specific job on the panel line.

Product categories

A complete chemistry toolkit.

01

Bio-based adhesives

Dual-component bio-adhesive systems that replace urea content and cut reliance on synthetic petrochemical resins.

02

Extenders & additives

Adhesive extenders and viscosity additives that conserve resin and improve the consistency of every glue line.

03

Resin boosters & tannins

Boosters and vegetable-tannin additives for UF, MUF and PF systems that lift viscosity and speed the press cycle.

04

Formaldehyde scavengers

Nano-particle scavengers for amino and phenolic resins that drive free-formaldehyde toward E1 / E0 targets.

05

Fire-retardant chemistry

Nano-particle dips, additives and coatings that raise the flame resistance of panels, doors and MDF.

06

Botanical wood protection

Neem & karanj emulsions and plant-derived additives for eco-friendly termite, borer and fungus resistance.

Where it’s used

Chemistry across the wood-based panel industry.

From plywood glue lines to continuous MDF presses, the POLYMATE range shows up wherever resin meets substrate.

Plywood & block board

Extenders and boosters for stronger, more economical glue lines.

MDF & particle board

Additives tuned for high-throughput continuous and multi-daylight presses.

Laminates & veneers

Chemistry that supports clean bonding and surface performance.

Resin manufacturing

Boosters and scavengers built into UF, MUF and PF resin production.

Industries servedPlywood manufacturingMDF & particle boardLaminates & veneersResin & adhesive producersBlock board & flush doorsVeneer & face processing

Providing you with adhesive solutions.

Need a technical data sheet or the right grade?

Tell us about your resin system and press cycle, and we’ll recommend the right product and dosing.